Cold plates mounted directly to the silicon — CPU, GPU, memory and voltage regulators. Liquid flows through micro-channel copper plates, extracting heat at its source before it reaches the ambient air.
DCX's Direct-to-Chip systems capture 70–80% of server heat at the source, dramatically reducing the air-conditioning load on the rest of the data hall. Pair with any DCX CDU, plug into your facility water loop, and you're ready for 100+ kW racks.
Fully submerge 19" or OCP 21" servers in DCX-engineered dielectric fluid. The fluid absorbs 100% of the heat — no fans, no hot aisles, no CRACs.
DCX pioneered the use of low-viscosity engineered fluids — not mineral oils — to maximize heat transfer while staying safe, odorless and long-life. The H1000 Standard Immersion System is the first enclosure built for standard rack servers, and the Edge Immersion Enclosure brings the same technology to outdoor telco sites.
The heart of every liquid-cooled data center. DCX CDUs take building water and deliver clean, temperature-controlled, filtered coolant to your racks at precisely the right flow and pressure.
The portfolio spans from 600 kW Entry units for single-pod deployments to the industry-leading 8 MW FDU AT4 — the largest single-footprint coolant distribution unit on the market. Every unit is available with N+1 or 2N redundancy, warm-water compatible up to 45°C and integrates seamlessly with your BMS.
In the Middle East, heat rejection is the hardest part of the thermal loop. DCX dry coolers are engineered specifically for high-ambient operation — the only way to deliver sub-1.2 PUE when summer hits +50°C.
V-shape high-density coils, corrosion-resistant materials, EC variable-speed fans and optional adiabatic boost let us hit the approach temperatures other vendors can't touch. From 15 kW edge units all the way to 2 MW facility-scale.
When you need compute capacity in months, not years, DCX modular data centers are the answer. Factory-integrated with liquid cooling, power, networking and fire-suppression — ready to ship.
Available in two flavors: Direct-to-Chip Modular DC for maximum density (up to 150 kW/rack), or Immersion Modular DC for 100% heat capture and silent operation. Both fully scalable, quick to deploy, and perfect for edge AI, disaster recovery or temporary capacity.
DCX pioneered the shift from mineral oils to engineered dielectric fluids. The result: higher heat transfer, longer service life, safer handling and a cleaner environmental profile.
Our flagship Thermasafe and DCX engineered coolants are non-toxic, non-allergenic, odorless and biodegradable. They're also priced for real-world deployment — not just showcases. We stock bulk volumes for GCC customers with local delivery.
A quick side-by-side — talk to us for a climate-adjusted, workload-specific recommendation.
| Air Cooling | Direct-to-Chip | Immersion | |
|---|---|---|---|
| Heat Capture | ~30% | 70–80% | 100% |
| Max Density | ~15 kW/rack | 150 kW/rack | 200+ kW/rack |
| PUE | 1.5–2.0 | 1.1–1.2 | 1.03–1.10 |
| Retrofit Complexity | — | Low | Medium |
| Silent Operation | No | Partial | Yes |
| Outdoor-Ready | No | No | Yes (Edge Immersion) |
| Ideal For | Legacy | AI / HPC retrofits | Hyperscale AI, Edge, Mining |
